Blar i SINTEF Open på forfatter "collini, cristian"

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    • Through Silicon Vias in MEMS packaging, a review 

      Sordo, Guido; Wright, Daniel Nilsen; Moe, Sigurd T.; collini, cristian (Lecture, 2019)
      Trough Silicon Via (TSV) is a key enabling technology to achieve the integration of various dies by exploiting the third dimension. This allow the integration of heterogeneous chips in a single package (2.5D integration) ...